Etching is a process that selectively removes excess material from the surface of silicon wafers using chemical or physical means. It is also a general term for a type of technology that uses solutions, reactive ions, and other physical methods to strip and remove materials. Etching technology is mainly divided into two categories: dry etching and wet etching: dry etching uses reactive gases and plasma as the main means to achieve etching; Wet etching achieves removal by reacting chemical reagents with the material to be etched. We have multiple advanced etching technologies.

Details such as etching agents, etching accuracy, etching materials, etching techniques, etc. can be discussed and inquired about: 15655181712 (phone/WeChat)