Photolithography process is a key step in the semiconductor device fabrication process, which forms corresponding pattern structures on the surface of photoresist through exposure and development. Then, with the help of etching process, the patterns on the mask are accurately transferred onto the substrate material. The substrate here is not limited to silicon wafers, but can also include various metal layers and dielectric layers. I have mastered multiple photolithography related technologies.
Coating, as a widely used surface treatment technology, usually deposits metal or non-metal materials in vapor phase on the substrate surface under vacuum conditions, forming a dense and uniform thin film layer. In the process of semiconductor device preparation, the quality of coating directly affects the final performance and functional implementation of the device. We have multiple mature coating processes and technological reserves.
Etching is a process that selectively removes excess material from the surface of silicon wafers using chemical or physical means. It is also a general term for a type of technology that uses solutions, reactive ions, and other physical methods to strip and remove materials. Etching technology is mainly divided into two categories: dry etching and wet etching: dry etching uses reactive gases and plasma as the main means to achieve etching; Wet etching achieves removal by reacting chemical reagen
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