Etching is a process that selectively removes excess material from the surface of silicon wafers using chemical or physical means. It is also a general term for a type of technology that uses solutions, reactive ions, and other physical methods to strip and remove materials. Etching technology is mainly divided into two categories: dry etching and wet etching: dry etching uses reactive gases and plasma as the main means to achieve etching; Wet etching achieves removal by reacting chemical reagents with the material to be etched. We have multiple advanced etching technologies.
