Customer Background

A leading domestic logic foundry plans to adopt STT-MRAM as the embedded memory solution for the 22nm process node, and needs to build comprehensive wafer-level testing capabilities.

Challenges

• Rapid acquisition of key device parameter distributions (Tpulse, TMR, Hc, σ) during process development

• Low testing efficiency of the traditional probe station plus oscilloscope solution, failing to meet DOE requirements

• Lack of dedicated failure analysis tools for magnetic memory

Jimiao Solution

A fully automated 12-inch testing platform was deployed, integrated with automatic wafer map generation, multi-temperature testing and statistical yield analysis modules.

Achievements

• Testing time per wafer reduced from 48 hours to 6 hours

• Cycle for identifying critical process windows cut by 60%

• Successfully passed customer reliability certification and entered small-batch trial production